Patent · US Active

Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

US11869790B2 · kind B2 · utility

0Cited by

4References

15Claims

0Family size

Assignee

Kokusai Electric Corporation · JP

Inventors

Yuji Takebayashi · Kagoshima, JP
Toshiro Koshimaki · Toyama, JP

Key dates

Filing date	Sep 30, 2022
Grant date	Jan 9, 2024
Priority date	—
Expiry date	Sep 30, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

There is provided a technique that includes: at least one process chamber configured to be capable of processing a substrate; one or more supports configured to be capable of supporting the substrate; a transporter configured to be capable of transporting the one or more supports; a transfer chamber configured to be capable of transferring the substrate; a transport chamber that is adjacent to the transfer chamber and the at least one process chamber and is configured to be capable of moving the transporter; and a delivery chamber that is disposed in the transport chamber and is configured to be capable of delivering the one or more supports.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.