Feeder design with high current capability
US11869940B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2023 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Jan 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8325
Abstract
A feeder design is manufactured as a structure in a SiC semiconductor material comprising at least two p-type grids in an n-type SiC material (3), comprising at least one epitaxially grown p-type region, wherein an Ohmic contact is applied on the at least one epitaxially grown p-type region, wherein an epitaxially grown n-type layer is applied on at least a part of the at least two p-type grids and the n-type SiC material (3) wherein the at least two p-type grids (4, 5) are applied in at least a first and a second regions at least close to the at least first and second corners respectively and that there is a region in the n-type SiC material (3) between the first and a second regions without any grids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.