Antenna modules and communication devices
US11870132B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2022 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | May 9, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/38
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.