Multi-level RF pulse monitoring and RF pulsing parameter optimization at a manufacturing system
US11874234B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2023 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Jan 23, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R27/32
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for RF pulse monitoring and RF pulsing parameter optimization at a manufacturing system are provided. A radio frequency (RF) signal is pulsed within a processing chamber in accordance with a set of process parameters. Sensor data is received from one or more sensors that indicates a RF pulse waveform detected within the processing chamber. One or more RF signal characteristics are identified in the detected RF pulse waveform. Each identified RF signal characteristic corresponds to at least one RF signal pulse of the RF signal pulsing within the processing chamber. A determination is made, based on the identified one or more RF signal characteristics, whether the detected RF pulse waveform corresponds to the target RF pulse waveform. An indication of whether the detected RF pulse waveform corresponds to the target RF pulse waveform is provided to a client device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.