Patent · US Active

Sensor devices with at least one bent connection conductor and methods for producing the sensor devices

US11874298B2 · kind B2 · utility

0Cited by

3References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Gernot Binder · Klagenfurt, AT
Ferdinand Gastinger · Klagenfurt, AT
Stephanie Jankowski · Regensburg, DE
Thomas Lassleben · Beratzhausen, DE

Key dates

Filing date	Mar 9, 2021
Grant date	Jan 16, 2024
Priority date	—
Expiry date	Aug 20, 2041

Classification

Technology area (CPC G)Physics
CPC primaryG01R33/091
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A sensor device includes a magnetic field sensor component, including a chip carrier having a connection conductor and a magnetic field sensor chip arranged on the chip carrier, and a magnet, wherein the magnetic field sensor component is arranged on a mounting surface of the magnet, wherein the mounting surface has an elevation and the connection conductor is bent around the elevation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.