Heat dissipating system
US11877381B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 15, 2022 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Jul 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20336
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipating system for electronic devices includes a first heat dissipation device, a second heat dissipation device, and a thermal conduction component. The thermal conduction component is disposed around the first heat dissipation device and configured to thermally contact a heat source. The second heat dissipation device is disposed adjacent to the thermal conduction component. The first heat dissipation device is configured to generate a first working fluid toward the thermal conduction component, such that the heat transferred from the heat source to the thermal conduction component is dispersed in a plurality of directions directing away from the first heat dissipation device. The second heat dissipation device is configured to generate a second working fluid, such that the heat distributed adjacent to the second heat dissipation device is dissipated in at least one direction directing away from the second heat dissipation device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.