Yi-Lun Cheng
37Patents
6h-index
26Co-inventors
65Inventor score
Filing activity: Apr 11, 2005 → Jul 20, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9740253B2 | Electronic apparatus | Physics | 22 | Active |
| US7212404B2 | Integrated heat sink device | Electricity | 16 | Expired |
| US7339787B2 | Heat sink module for dissipating heat from a heat source on a motherboard | Electricity | 14 | Active |
| US7558062B2 | Heat-dissipating module and electronic apparatus | Physics | 11 | Active |
| US7274572B2 | Supporting plate | Electricity | 8 | Expired |
| US7436673B2 | Heat sink fixing assembly | Electricity | 8 | Active |
| US9007769B2 | Electronic device | Physics | 6 | Active |
| US7319592B2 | Recyclable protective cover for a heat-conductive medium | Electricity | 6 | Active |
| US8482916B2 | Mobile computing apparatus | Physics | 4 | Active |
| US7277293B2 | Heat sink conduction apparatus | Electricity | 4 | Expired |
| US8340922B2 | Method for estimating fan life | Mechanical Engineering; Lighting; Heating | 4 | Active |
| US9382919B2 | Fan blade structure | Mechanical Engineering; Lighting; Heating | 3 | Active |
| US11877381B2 | Heat dissipating system | Electricity | 3 | Active |
| US9013876B2 | Electronic device | Electricity | 2 | Active |
| US7589969B2 | Folding protective cover for heat-conductive medium | Emerging Cross-Sectional Technologies | 2 | Active |
| US9013875B2 | Electronic device | Physics | 2 | Active |
| US9007770B2 | Electronic device | Electricity | 2 | Active |
| US9799585B2 | Method for forming a case for an electronic device and manufactured case structure for electronic device | Emerging Cross-Sectional Technologies | 1 | Active |
| US7248474B2 | Fool-proof device on heatsink thermal module for the notebook computer | Emerging Cross-Sectional Technologies | 1 | Expired |
| US9029696B2 | Electronic device | Electricity | 1 | Active |
| US10901471B2 | Heat dissipation assembly and portable electronic device | Physics | 1 | Active |
| US8641271B2 | Method for testing heat pipes | Physics | 1 | Active |
| US8897012B2 | Electronic device and heat dissipation module thereof | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US8078438B2 | Method for simulating thermal resistance value of thermal test die | Physics | 1 | Active |
| US9727090B2 | Portable electronic apparatus | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.