Method for manufacturing an integrated MEMS transducer device and integrated MEMS transducer device
US11878906B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2022 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Sep 30, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/053
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
In an embodiment, an integrated MEMS transducer device includes a substrate body having a first electrode on a substrate, an etch stop layer located on a surface of the substrate, a suspended micro-electro-mechanical systems (MEMS) diaphragm with a second electrode, an anchor structure with anchors connecting the MEMS diaphragm to the substrate body and a sacrificial layer in between the anchors of the anchor structure, the sacrificial layer including a first sub-layer of a first material, wherein the first sub-layer is arranged on the etch stop layer, a second sub-layer of a second material, wherein the second sub-layer is arranged on the first sub-layer, and wherein the first and the second material are different materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.