System and method for rendering SEM images and predicting defect imaging conditions of substrates using 3D design
US11880193B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2019 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Sep 9, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A system for characterizing a specimen is disclosed. In one embodiment, the system includes a characterization sub-system configured to acquire one or more images a specimen, and a controller communicatively coupled to the characterization sub-system. The controller may be configured to: receive training images of one or more features of a specimen from the characterization sub-system; receive training three-dimensional (3D) design images corresponding to the one or more features of the specimen; generate a deep learning predictive model based on the training images and the training 3D design images; receive product 3D design images of one or more features of a specimen; generate simulated images of the one or more features of the specimen based on the product 3D design images with the deep learning predictive model; and determine one or more characteristics of the specimen based on the one or more simulated images.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.