Substrate transferring unit, substrate processing apparatus, and substrate processing method
US11881426B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2022 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Jun 1, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2004
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes: a first process chamber in which a developing process is performed by supplying a developer to a substrate that is in a dry state; a second process chamber in which a drying process is performed on the substrate by supplying a supercritical fluid to the substrate on which the developing process is performed and which is in a wet state; a third process chamber in which a bake operation is performed on the substrate on which the drying operation is performed and is in a dry state; a fourth process chamber in which a cooling operation is performed on the substrate on which the bake operation is performed and is in a dry state; and a substrate transferring unit configured to transfer the substrate between the first to fourth process chambers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.