Multi chip hardware security module

US11882645B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Sushumna Iruvanti · Wappingers Falls, US
• James A. Busby · New Paltz, US
• Philipp K Buchling Rego · Wappingers Falls, US
• Steven P. Ostrander · Poughkeepsie, US
• Thomas A. Wassick · Lagrangeville, US
• William Santiago-Fernandez · Poughkeepsie, US
• Nihad Hadzic · Beacon, US

Key dates

• Filing date: Oct 22, 2021
• Grant date: Jan 23, 2024
• Expiry date: May 27, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/42
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.