Thomas A. Wassick
56Patents
12h-index
136Co-inventors
87Inventor score
Filing activity: Oct 31, 1985 → Nov 8, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4684437A | Selective metal etching in metal/polymer structures | Performing Operations; Transporting | 121 | Expired |
| US9853006B2 | Semiconductor device contact structure having stacked nickel, copper, and tin layers | Electricity | 47 | Active |
| US9396991B2 | Multilayered contact structure having nickel, copper, and nickel-iron layers | Electricity | 46 | Active |
| US6682872B2 | UV-curable compositions and method of use thereof in microelectronics | Emerging Cross-Sectional Technologies | 35 | Expired |
| US5843363A | Ablation patterning of multi-layered structures | Electricity | 35 | Expired |
| US5153408A | Method and structure for repairing electrical lines | Emerging Cross-Sectional Technologies | 23 | Expired |
| US5246745A | Laser-induced chemical vapor deposition of thin-film conductors | Electricity | 22 | Expired |
| US6427324B1 | Inherently robust repair process for thin film circuitry using UV laser | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6444919B1 | Thin film wiring scheme utilizing inter-chip site surface wiring | Electricity | 16 | Expired |
| US7019402B2 | Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor | Electricity | 14 | Expired |
| US5543584A | Structure for repairing electrical lines | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5766497A | Ablation pattering of multilayered structures | Electricity | 12 | Expired |
| US6235544A | Seed metal delete process for thin film repair solutions using direct UV laser | Electricity | 10 | Expired |
| US6002267A | In-line voltage plane tests for multi-chip modules | Physics | 9 | Expired |
| US7716992B2 | Sensor, method, and design structure for a low-k delamination sensor | Electricity | 8 | Active |
| US6541709B1 | Inherently robust repair process for thin film circuitry using uv laser | Emerging Cross-Sectional Technologies | 8 | Expired |
| US9084378B2 | Under ball metallurgy (UBM) for improved electromigration | Electricity | 8 | Active |
| US9379007B2 | Electromigration-resistant lead-free solder interconnect structures | Electricity | 7 | Active |
| US6323045A | Method and structure for top-to-bottom I/O nets repair in a thin film transfer and join process | Electricity | 6 | Expired |
| US7875502B2 | Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners | Electricity | 5 | Active |
| US8298929B2 | Offset solder vias, methods of manufacturing and design structures | Emerging Cross-Sectional Technologies | 4 | Active |
| US6048741A | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Emerging Cross-Sectional Technologies | 3 | Expired |
| US5937269A | Graphics assisted manufacturing process for thin-film devices | Electricity | 2 | Expired |
| US8487447B2 | Semiconductor structure having offset passivation to reduce electromigration | Electricity | 2 | Active |
| US6455331B2 | Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.