Smooth metal layers in Josephson junction devices
US11882771B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Oct 18, 2021 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Feb 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/0241
Abstract
Techniques and methods to form smooth metal layers deposited onto selected surfaces of Josephson junction devices are provided. For example, one or more embodiments described herein can comprise depositing a layer of a first material comprising metal atom species on a selected surface of a device layer; depositing a layer of a second material on a surface of the layer of first material; and performing plasma etching on the layer of second material and the layer of first material to form an etched surface of the layer of first material that is smoother than the surface of the layer of first material, as deposited.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.