Adhesive film including a (meth)acrylate matrix including a curable epoxy/thiol resin composition, tape, and method
US11884850B2 · kind B2 · utility
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16References
17Claims
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Key dates
| Filing date | Sep 14, 2018 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Sep 18, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A thermally curable adhesive film, a tape, and a method of making the tape, wherein the film includes: a crosslinked (meth)acrylate matrix; and a thermally curable, one-part epoxy/thiol resin composition incorporated within the crosslinked (meth)acrylate matrix; wherein the thermally curable, one-part epoxy/thiol resin composition comprises: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two thiol groups; a nitrogen-containing catalyst for the epoxy resin; and an organic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.