Integrated wafer bow measurements
US11885750B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2020 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Oct 23, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2210/56
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In some examples, a wafer bow measurement system comprises a measurement unit including: a wafer support assembly to impart rotational movement to a measured wafer supported in the measurement unit; an optical sensor; a calibration standard to calibrate the optical sensor; a linear stage actuator to impart linear direction of movement to the optical sensor; a wafer centering sensor to determine a centering of the measured wafer supported in the measurement unit; and a wafer alignment sensor to determine an alignment of the measured wafer supported in the measurement unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.