Patent · US Active

Adaptive focusing and transport system for electroplating

US11887874B2 · kind B2 · utility

0Cited by

1References

7Claims

0Family size

Assignee

ASMPT NEXX, INC. · US

Inventors

Arthur Keigler · Billerica, US
David G. Guarnaccia · Carlisle, US
Freeman Fisher · Boston, US
Demetrius Papapanayiotou · Westford, US
Jonathan Haynes · Petersham, US
Daniel Goodman · Lexington, US

Key dates

Filing date	Jan 11, 2023
Grant date	Jan 30, 2024
Priority date	—
Expiry date	Jan 11, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68764
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system and method for plating a workpiece are described. In one aspect, an apparatus includes a deposition chamber, a workpiece holder adapted for insertion into and removal from the deposition chamber, a shield with patterns of apertures corresponding to features on the workpiece, a shield holder also adapted for insertion into and removal from the deposition chamber and a positioning mechanism to position the workpiece in the workpiece holder such that the pattern of apertures on the shield will align with the corresponding features on the workpiece when the workpiece holder and shield holder are inserted into the deposition chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.