Component carrier comprising embedded magnet stack
US11889629B2 · kind B2 · utility
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2References
14Claims
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Assignee
Inventors
Key dates
| Filing date | Apr 28, 2020 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Aug 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1003
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.