Apparatus for treating substrate
US11890639B2 · kind B2 · utility
1Cited by
15References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2020 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Jul 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a fluid supply unit for supplying supercritical fluid to the treatment space, and a controller configured to control the fluid supply unit, wherein the fluid supply unit is configured to selectively supply the supercritical fluid at a first density or a second density higher than the first density into the treatment space. Thus, drying efficiency of the substrate when drying the substrate using the supercritical fluid may be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.