Chemical mechanical polishing slurry buildup monitoring
US11890722B2 · kind B2 · utility
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1References
8Claims
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Key dates
| Filing date | Apr 5, 2021 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Dec 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image sensor configured to image the surface, and a processor coupled to the image sensor and configured to monitor slurry buildup on the surface using data supplied from the image sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.