Photonic quantum computer assembly
US11892693B1 · kind B1 · utility
1Cited by
49References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2022 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Sep 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes a die stack including a first die including a quantum circuit and a second die including an electronic circuit. The second die and the first die face each other. The device also includes a first interconnect between the quantum circuit and the electronic circuit and a second interconnect between the quantum circuit and the electronic circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.