Device for adjusting wafer, reaction chamber, and method for adjusting wafer
US11892778B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2022 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | May 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments of the present disclosure provide a device for adjusting a wafer, a reaction chamber, and a method for adjusting a wafer. The device for adjusting a wafer includes: a lifting module, the lifting module including a first carrier surface configured to carry a wafer, and the first carrier surface ascending to a preset highest position or descending to a preset lowest position relative to a reference surface; a carrier module, the carrier module including a second carrier surface, a position of the second carrier surface being higher than the preset lowest position and being lower than the preset highest position, and the second carrier surface being configured to receive and carry the wafer carried on the first carrier surface; and a suction module, the suction module including a first suction opening facing the wafer and surrounded by the second carrier surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.