Dual head capillary design for vertical wire bond
US11894334B2 · kind B2 · utility
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10Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 15, 2018 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Aug 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06562
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments disclosed herein include wire bonds and tools for forming wire bonds. In an embodiment, a wire bond may comprise a first attachment ball, and a first wire having a first portion contacting the first attachment ball and a second portion. In an embodiment, the wire bond may further comprise a second attachment ball, and a second wire having a first portion contacting the second attachment ball and a second portion. In an embodiment, the second portion of the first wire is connected to the second portion of the second wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.