Nozzle, substrate processing apparatus including the same, and substrate processing method
US11897005B2 · kind B2 · utility
0Cited by
2References
13Claims
0Family size
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Key dates
| Filing date | Nov 15, 2022 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Nov 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/2465
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The inventive concept provides a nozzle for dispensing a treatment liquid in which plasma is generated. The nozzle includes a body having an interior space, a liquid supply unit that supplies the treatment liquid into the interior space, and electrodes that generate the plasma in the interior space. The liquid supply unit supplies the treatment liquid in a bubbling state into the interior space, or causes the treatment liquid to bubble in the interior space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.