Patent · US Active

Micromechanical device with contact pad

US11897756B2 · kind B2 · utility

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0References

7Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Jochen Reinmuth · Reutlingen, DE
Martin Rambach · Neckartenzlingen, DE

Key dates

Filing date	May 3, 2022
Grant date	Feb 13, 2024
Priority date	—
Expiry date	May 3, 2042

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2207/097
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A micromechanical device that includes a MEMS substrate and a cap substrate that enclose at least one first cavity, with at least one contact pad that is situated outside the first cavity. A MEMS structure is situated in the first cavity and connected to the contact pad with the aid of a strip conductor, the strip conductor extending at least partially in the MEMS substrate. The contact pad is situated at a surface of the cap substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.