Semiconductor device and method for forming the same
US11897759B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 10, 2022 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Jun 10, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0792
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.