Chiahung Liu
12Patents
2h-index
17Co-inventors
43Inventor score
Filing activity: Sep 12, 2018 → Jan 5, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10840227B2 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Electricity | 5 | Active |
| US10832985B2 | Sensor package and method | Electricity | 5 | Active |
| US10861841B2 | Semiconductor device with multiple polarity groups | Electricity | 1 | Active |
| US11897759B2 | Semiconductor device and method for forming the same | Performing Operations; Transporting | 0 | Active |
| US12205860B2 | Sensor packages | Electricity | 0 | Active |
| US11742254B2 | Sensor package and method | Electricity | 0 | Active |
| US11631658B2 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Electricity | 0 | Active |
| US11049850B2 | Methods of bonding the strip-shaped under bump metallization structures | Electricity | 0 | Active |
| US11527525B2 | Semiconductor device with multiple polarity groups | Electricity | 0 | Active |
| US10658348B2 | Semiconductor devices having a plurality of first and second conductive strips | Electricity | 0 | Active |
| US11842993B2 | Semiconductor device with multiple polarity groups | Electricity | 0 | Active |
| US12227410B2 | Semiconductor device and method for forming the same | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.