Single and multi-layer mesh structures for enhanced thermal transport
US11898807B2 · kind B2 · utility
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Key dates
| Filing date | Mar 8, 2022 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Mar 8, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/427
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.