Patent · US Active

Photosensitive polyimide compositions

US11899364B2 · kind B2 · utility

1Cited by

17References

22Claims

0Family size

Assignee

Fujifilm Electronic Materials U.S.A., Inc. · US

Inventors

Binod B. De · Attleboro, US
Sanjay Malik · Attleboro, US
Raj Sakamuri · Sharon, US
William A. Reinerth · Westminster, US
Ognian N. Dimov · East Greenwich, US
Ahmad A. Naiini · East Greenwich, US

Key dates

Filing date	Mar 18, 2020
Grant date	Feb 13, 2024
Priority date	—
Expiry date	Apr 30, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/311
WIPO fieldOptics
WIPO sectorInstruments

Abstract

This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.