Fluid flow control system comprising a manifold assembly
US11899477B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2022 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | May 5, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67017
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Systems for processing articles are essential for semiconductor fabrication. In one embodiment, a system is disclosed comprising a plurality of fluid supplies configured to supply process fluids, a plurality of apparatuses for controlling flow, a plurality of mounting substrates, a vacuum manifold fluidly coupled to the plurality of mounting substrates, an outlet manifold fluidly coupled to the plurality of mounting substrates, a vacuum source fluidly coupled to the vacuum manifold, and a processing chamber fluidly coupled to the outlet manifold. The plurality of apparatuses for controlling flow have a bleed port and an outlet. The outlets of the plurality of apparatuses are fluidly coupled to corresponding outlet ports of the plurality of mounting substrates. The bleed ports of the plurality of apparatuses are fluidly coupled to the corresponding vacuum ports of the plurality of mounting substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.