Cooling solution including microchannel arrays and methods of forming the same
US11901262B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Jan 24, 2019 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Mar 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments include a cooling solution having a first array of fins, where the first array of fins extend vertically from the substrate, and where adjacent individual fins of the first array are separated from each other by a microchannel. A second array of fins extend vertically from the substrate, where a channel region is between the first array of fins and the second array of fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.