Electronic assembly
US11901310B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2019 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Oct 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of stiffening members coupled to the substrate. The substrate further includes a plurality of substrate interconnects. The electronic assembly further includes a plurality of semiconductor dies mounted on the first surface of the substrate. The plurality of semiconductor dies are electrically connected to each other via the plurality of substrate interconnects. The electronic assembly further includes a plurality of power supply modules mounted on the second surface of the substrate. Each power supply module is disposed opposite to a respective semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.