Patent · US Active

Package device

US11901315B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

INNOLUX CORPORATION · TW

Inventors

Yeong-E Chen · 東區, TW
Wei Chen · Palo Alto, US
Chun-Yuan Huang · Hsinchu, TW

Key dates

Filing date	Oct 7, 2021
Grant date	Feb 13, 2024
Priority date	—
Expiry date	Feb 25, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH10D1/692
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An embodiment of the disclosure provides a package device including a redistribution layer, an integrated passive device layer, a first port, and a second port. The integrated passive device layer contacts the redistribution layer. The integrated passive device layer has at least one capacitor. The at least one capacitor includes a first capacitor and a second capacitor. The first port is electrically connected to the first capacitor and the second capacitor. The second port is provided opposite to the first port. The second port is electrically connected to the first capacitor and the second capacitor. The first port and the second port have the same resistance.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.