Wire bonding for semiconductor devices
US11901327B2 · kind B2 · utility
0Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2021 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | May 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes an integrated circuit die having bond pads and a bond wires. The bond wires are connected to respective ones of the bond pads by a ball bond. An area of contact between the ball bond and the bond pad has a predetermined shape that is non-circular and includes at least one axis of symmetry. A ratio of the ball bond length to the ball bond width may be equal to a ratio of the bond pad length to the bond pad width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.