Process of manufacturing a pressure sensitive adhesive having a low VOC characteristics

US11905438B2 · kind B2 · utility

Assignee

• 3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

• Niklas M. Matzeit · Cologne, DE
• Pierre R. Bieber · Goldkronach, DE
• Petra M. Stegmaier · Goldkronach, DE
• Eike H. Klünker · Kaarst, DE
• Dmitri D. Iarikov · Gaithersburg, US
• Jeffrey M. Imsande · Menomonie, US
• Shijing Cheng · Woodbury, US
• Michele A. Craton · Hudson, US
• George J. Clements · Afton, US

Key dates

• Filing date: Jun 20, 2019
• Grant date: Feb 20, 2024
• Expiry date: Feb 15, 2041

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J2301/50
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii. optionally, further ethylenically unsaturated monomer units which are copolymerizable with monomer units (i) and/or (ii); and (2) a crosslinking system selected from the group consisting of thermal crosslinking systems, actinic radiation crosslinking systems, and any combinations thereof; (3) optionally, at least one expandable microsphere; and (4) optionally, at least one pigment; c) providing a polymeric resin; d) subjecting the polymeric resin to a heating step (thereby at least partly remove low Volatile Organic Compounds (VOC) from the polymeric resin) thereby forming a cleaned polymeric …