Photonics integration in semiconductor packages
US11906802B2 · kind B2 · utility
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5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2022 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | May 10, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/12004
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An apparatus includes a substrate that includes one or more routing layers, and an optical module coupled to the substrate. The optical module includes a photonic integrated circuit (PIC) and electronic integrated circuit (EIC), wherein the photonic integrated circuit is at least partially embedded within the substrate. The apparatus further includes a fiber optic coupler coupled to at least one of the substrate or PIC, wherein the PIC is configured to transmit or receive an optical signal via the fiber optic coupler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.