Inventor · Irvine, CA, US

Liming Tsau

21Patents
7h-index
29Co-inventors
69Inventor score

Filing activity: Dec 31, 1998 → May 13, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US6417094B1 Dual-damascene interconnect structures and methods of fabricating same Electricity 63 Expired
US7329955B2 Metal-insulator-metal (MIM) capacitor Emerging Cross-Sectional Technologies 12 Expired
US7187015B2 High-density metal capacitor using dual-damascene copper interconnect Electricity 11 Expired
US6960819B2 System and method for one-time programmed memory through direct-tunneling oxide breakdown Electricity 11 Expired
US6833604B2 High density metal capacitor using dual-damascene copper interconnect Electricity 11 Expired
US6803306B2 High density metal capacitor using via etch stopping layer as field dielectric in dual-damascence interconnect process Emerging Cross-Sectional Technologies 10 Expired
US6985387B2 System and method for one-time programmed memory through direct-tunneling oxide breakdown Electricity 9 Expired
US9741667B2 Integrated circuit with die edge assurance structure Electricity 5 Active
US6902972B2 High-density metal capacitor using dual-damascene copper interconnect Electricity 4 Expired
US6952053B2 Metal bond pad for integrated circuits allowing improved probing ability of small pads Emerging Cross-Sectional Technologies 4 Expired
US6950355B2 System and method to screen defect related reliability failures in CMOS SRAMS Physics 2 Expired
US7009891B2 System and method for one-time programmed memory through direct-tunneling oxide breakdown Electricity 1 Expired
US10629504B2 Die edge crack and delamination detection Electricity 0 Active
US12068232B2 Integrated circuit package with serpentine conductor and method of making Electricity 0 Active
US12191243B2 Cantilevered power planes to provide a return current path for high-speed signals Electricity 0 Active
US7049204B2 High density metal capacitor using via etch stopping layer as field dielectric in dual-damascence interconnect process Emerging Cross-Sectional Technologies 0 Expired
US8106476B2 Semiconductor die with fuse window and a monitoring window over a structure which indicates fuse integrity Electricity 0 Active
US12216153B2 Semiconductor product with edge integrity detection structure Electricity 0 Active
US11049829B2 Redistribution metal and under bump metal interconnect structures and method Electricity 0 Active
US10504862B2 Redistribution metal and under bump metal interconnect structures and method Electricity 0 Active
US11906802B2 Photonics integration in semiconductor packages Physics 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.