Patent · US Active

In-situ metrology and process control

US11908718B2 · kind B2 · utility

0Cited by

3References

11Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Ramesh Krishnamurthy · Sunnyvale, US
Lakshmanan Karuppiah · San Jose, US

Key dates

Filing date	Feb 22, 2022
Grant date	Feb 20, 2024
Priority date	—
Expiry date	May 21, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/24
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Methods and apparatus for the in-situ measurement of metrology parameters are disclosed herein. Some embodiments of the disclosure further provide for the real-time adjustment of process parameters based on the measure metrology parameters. Some embodiments of the disclosure provide for a multi-stage processing chamber top plate with one or more sensors between process stations.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.