Hybrid semiconductor device and electronic device
US11908810B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2021 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | May 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49816
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hybrid semiconductor device includes an interposer substrate, a semiconductor package mounted on the interposer substrate, a molding member on the package substrate covering at least a portion of the semiconductor chip and exposing an upper surface of the semiconductor chip, and a stiffener disposed on an upper surface of the interposer substrate substantially around the semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.