Junso Pak
4Patents
0h-index
7Co-inventors
21Inventor score
Filing activity: Sep 29, 2021 → Feb 3, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11908810B2 | Hybrid semiconductor device and electronic device | Electricity | 0 | Active |
| US11908758B2 | Semiconductor package including dual stiffener | Electricity | 0 | Active |
| US12224260B2 | Semiconductor package including a dualized signal wiring structure | Electricity | 0 | Active |
| US12213256B2 | Semiconductor package for improving power integrity characteristics | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.