Process for collectively bending microelectronic components using shaping carrier
US11908832B2 · kind B2 · utility
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14Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 21, 2021 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Jan 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/08235
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process for collectively bending microelectronic components comprising transferring microelectronic components (10) to and bending them on curved surfaces (21) of a shaping carrier (20), an adhesive layer (6) ensuring adhesion of the microelectronic components (10), and comprising producing conductive vias (22) that extend through the shaping carrier (20) and the adhesive lower layer (6), from the lower face (20i) of the shaping carrier (20), in order to emerge onto the lower conductive pads (12) of the microelectronic components (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.