MEMS microphone and package with integrated passive acoustic filter, extended soundport
US11910154B2 · kind B2 · utility
2Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2022 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Apr 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A MEMS device includes a package for providing an inner volume, a MEMS microphone arranged in the inner volume, a sound port through the package to the inner volume, and a passive acoustic attenuation filter acoustically coupled to the sound port.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.