Printed circuit board stack structure and manufacturing method thereof
US11910535B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2022 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Apr 5, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board stack structure includes a first printed circuit board, a second printed circuit board, and a filling glue layer. The first printed circuit board has at least one overflow groove, and includes first pads and a retaining wall surrounding the first pads. The second printed circuit board is disposed on the first printed circuit board, and includes second pads and conductive pillars located on some of the second pads. The conductive pillars are respectively connected to some of the first pads to electrically connect the second printed circuit board to the first printed circuit board. The filling glue layer fills between the first and the second printed circuit boards, and covers the first pads, the second pads, and the conductive pillars. The retaining wall blocks the filling glue layer so that a portion of the filling glue layer is accommodated in the overflow groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.