Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby
US11915949B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 15, 2021 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Sep 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.