Photolithography alignment process for bonded wafers
US11916022B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2022 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Jun 7, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments of the present disclosure are directed towards a semiconductor processing system including an overlay (OVL) shift measurement device. The OVL shift measurement device is configured to determine an OVL shift between a first wafer and a second wafer, where the second wafer overlies the first wafer. A photolithography device is configured to perform one or more photolithography processes on the second wafer. A controller is configured to perform an alignment process on the photolithography device according to the determined OVL shift. The photolithography device performs the one or more photolithography processes based on the OVL shift.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.