MOSFET device of silicon carbide having an integrated diode and manufacturing process thereof
US11916066B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2022 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Feb 2, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated MOSFET device is formed in a body of silicon carbide and with a first type of conductivity. The body accommodates a first body region, with a second type of conductivity; a JFET region adjacent to the first body region; a first source region, with the first type of conductivity, extending into the interior of the first body region; an implanted structure, with the second type of conductivity, extending into the interior of the JFET region. An isolated gate structure lies partially over the first body region, the first source region and the JFET region. A first metallization layer extends over the first surface and forms, in direct contact with the implanted structure and with the JFET region, a JBS diode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.