Patent · US Active

MOSFET device of silicon carbide having an integrated diode and manufacturing process thereof

US11916066B2 · kind B2 · utility

0Cited by
6References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 2, 2022
Grant dateFeb 27, 2024
Priority date
Expiry dateFeb 2, 2042

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D84/146
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An integrated MOSFET device is formed in a body of silicon carbide and with a first type of conductivity. The body accommodates a first body region, with a second type of conductivity; a JFET region adjacent to the first body region; a first source region, with the first type of conductivity, extending into the interior of the first body region; an implanted structure, with the second type of conductivity, extending into the interior of the JFET region. An isolated gate structure lies partially over the first body region, the first source region and the JFET region. A first metallization layer extends over the first surface and forms, in direct contact with the implanted structure and with the JFET region, a JBS diode.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.