Polishing head, substrate processing apparatus including the same and processing method of substrate using the same
US11919122B2 · kind B2 · utility
0Cited by
2References
10Claims
0Family size
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Key dates
| Filing date | Sep 29, 2020 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Nov 6, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.