Systems and methods for electrochemical additive manufacturing of parts using multi-purpose build plate
US11920251B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2022 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Sep 6, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrochemical additive manufacturing method includes positioning a build plate into an electrolyte solution. The conductive layer comprises at least one conductive-layer segment forming a pattern corresponding with a component. The method further comprises connecting the at least one conductive-layer segment and one or more deposition anodes to a power source. The one or more deposition anodes correspond with at least a portion of the pattern formed by the at least one conductive-layer segment. The method additionally comprises transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes corresponding with the at least the portion of the pattern formed by the at least one conductive-layer segment, through the electrolyte solution, and to the at least one conductive-layer segment, such that material is deposited onto the at least one conductive-layer segment and forms at least a portion of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.