Michael Matthews
8Patents
3h-index
13Co-inventors
50Inventor score
Filing activity: Mar 31, 2010 → Feb 21, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9583453B2 | Semiconductor packaging containing sintering die-attach material | Electricity | 8 | Active |
| US8221518B2 | Conductive compositions containing blended alloy fillers | Electricity | 8 | Active |
| US9005330B2 | Electrically conductive compositions comprising non-eutectic solder alloys | Performing Operations; Transporting | 5 | Active |
| US8840700B2 | Preparation of metallurgic network compositions and methods of use thereof | Electricity | 3 | Active |
| US12053934B2 | Conductive film adhesive | Electricity | 0 | Active |
| US10727193B2 | Sintering pastes with high metal loading for semiconductor die attach applications | Electricity | 0 | Active |
| US11920251B2 | Systems and methods for electrochemical additive manufacturing of parts using multi-purpose build plate | Emerging Cross-Sectional Technologies | 0 | Active |
| US12227862B2 | Methods for electrochemical additive manufacturing of parts | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.