Apparatuses and methods for determining wafer defects
US11922613B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2020 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Sep 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67288
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An inspection system for determining wafer defects in semiconductor fabrication may include an image capturing device to capture a wafer image and a classification convolutional neural network (CNN) to determine a classification from a plurality of classes for the captured image. Each of the plurality of classes indicates a type of a defect in the wafer. The system may also include an encoder to encode to convert a training image into a feature vector; a cluster system to cluster the feature vector to generate soft labels for the training image; and a decoder to decode the feature vector into a re-generated image. The system may also include a classification system to determine a classification from the plurality of classes for the training image. The encoder and decoder may be formed from a CNN autoencoder. The classification CNN and the CNN autoencoder may each be a deep neural network.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.