Apparatus and method for treating substrate
US11923212B2 · kind B2 · utility
0Cited by
0References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2020 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Mar 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for treating a substrate includes a process chamber having a process space inside, a support unit that supports the substrate in the process space, a heating unit that is provided inside the support unit and that heats the substrate, an exhaust unit that evacuates the process space, and a gas supply unit that supplies a gas into the process space, and the gas supply unit supplies the gas at a temperature selected from a first temperature and a second temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.